Before delving into key considerations, it is essential to comprehend the benefits of low-pressure molding to determine if it is a suitable solution. Compared to traditional high-pressure injection molding, low-pressure molding provides numerous advantages.
Unlike other potting methods, LPM utilizes a thermoplastic, hot melt adhesive with uniquely low viscosity, making it moldable in a low-pressure environment. This characteristic is particularly crucial for backshell manufacturing, especially when dealing with fragile electrical components that could be damaged by high-pressure injection molding processes. Moreover, hot melt adhesives have excellent adhesion and sealing properties, making them ideal for weather-resistant applications. LPM provides waterproofing, UV protection, and increased durability for delicate PCBAs and cable assemblies.
Additionally, this process does not involve a chemical curing phase. Because of this, excess materials such as runners and scraps can be melted down and recycled for future molds. This significantly reduces waste and the overall environmental impact of the production process.
Want more information on low pressure overmoulding, low pressure overmolding service, low pressure injection moulding? Click the link below to contact us.