Purpose: To remove the oxide layer and impurities on the metal surface, enhance the surface activity and improve the adhesion of plating layer. Role: Remove oxide film and oil contamination. To keep the metal surface in an active state for subsequent plating. Commonly used methods: Acidic solution (such as dilute sulfuric acid, hydrochloric acid) immersion. Electrochemical activation.
The difference between activation and alkaline etching in the plating process
Author: Robby
In electroplating process, activation and alkaline etching are two different steps, each with different purposes and functions.
1. Activation
Purpose: To remove the oxide layer and impurities on the metal surface, enhance the surface activity and improve the adhesion of plating layer.
Role:
Remove oxide film and oil contamination.
To keep the metal surface in an active state for subsequent plating.
Commonly used methods:
Acidic solution (such as dilute sulfuric acid, hydrochloric acid) immersion.
Electrochemical activation.
2. alkali etching
Purpose: Alkaline solution corrosion of the metal surface, to remove the oxide layer and impurities, and the formation of suitable for electroplating microscopic rough surface.
Function:
Remove oxide layer and oil contamination.
Formation of microscopic rough surface, enhance the adhesion of plating.
Commonly used methods:
Alkaline solution (e.g. sodium hydroxide, sodium carbonate) immersion.
Difference
Item Activation Alkaline etching
Purpose Enhance surface activity, improve adhesion Erode surface, remove oxide layer and impurities
Function Remove oxide film and oil contamination Form a microscopic rough surface
Method Acid solution or electrochemical activation Alkaline solution immersion
Applicable materials Various metals Mainly light metals such as aluminium, magnesium, etc.
Summary
Activation: Enhancement of surface activity and adhesion by acid treatment.
Alkaline etching: Erosion of the surface by alkaline treatment removes impurities and creates a rough surface.
Both work together to ensure the quality and adhesion of the plated layer.