\$\begingroup\$
It depends on your design but if I wanted use a design for high frequencies, I used through hole just for power/heating parts and used SMD for the rest because SMD design can reduce inductance and resistance of component parts .
Advantages of SMD:
1-Smaller components.
2- Much higher component density (components per unit area) and many more connections per component.
3-Lower initial cost and time of setting up for production. Fewer holes need to be drilled.
4-Simpler and faster automated assembly.
5- Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.
6-Components can be placed on both sides of the circuit board.
7-Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
8-Better mechanical performance under shake and vibration conditions.
9-Many SMT parts cost less than equivalent through-hole parts.
10-Better EMC compatibility (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the smaller lead inductance.
Disadvantages of SMD:
1- Manual prototype assembly or component-level repair is more difficult
2-SMDs cannot be used directly with breadboards
3-SMDs' solder connections may be damaged by potting compounds going through thermal cycling.
4- SMT is unsuitable for large, high-power, or high-voltage parts, for example in power circuitry.
5-SMT is unsuitable as the sole attachment method for components that are subject to frequent mechanical stress
If you have any questions on Surface Mount Technology. We will give the professional answers to your questions.